Semiconductor package with heat sink attached to substrate
US6849942B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2003 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | May 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a flange in contact with the substrate, allowing a plurality of clip members to clamp the flange of the heat sink and the substrate. Each of the clip members has a recess portion for receiving the flange of the heat sink and the substrate to thereby firmly position the heat sink on the substrate. The clip members are engaged with edges of the heat sink and the substrate, thereby not affecting trace routability on the substrate. Moreover, the heat sink is mounted on the substrate and would not be dislocated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.