Semiconductor die analysis via fiber optic communication
US6850081B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2002 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | Jun 5, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/31905
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Semiconductor analysis is improved via the use of fiber optic communications. According to an example embodiment of the present invention, a stimulation device is adapted to stimulate an integrated circuit die, and the die generates a response to the stimulation. An optical signal generator, either incorporated into the die or coupled to the die, detects the response, converts the response to an optical signal and transmits the optical signal. The optical signal is received at a testing arrangement adapted to analyze the die therefrom. The optical signal is used to analyze the die, improving signal quality and the ability to perform high-speed analysis of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.