Colloidal seed formulation for printed circuit board metallization
US6852152B2 · kind B2 · utility
8Cited by
26References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2002 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Feb 8, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/181
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A colloidal metal seed formulation useful for catalytically activating a surface of a non-conductive dielectric substrate in an electroless plating process is provided. The colloidal metal seed formulation includes stannous chloride, palladium chloride, HCl and a surfactant selected from a diphenyloxide disulfonic acid or alkali or alkaline earth metal salt thereof, C30H50O10, an alcohol alkoxylate and mixtures thereof. A method of electroless plating of a conductive metal onto a non-conductive dielectric substrate using the colloidal metal seed formulation is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.