Method of assembling a semiconductor device package
US6852567B1 · kind B1 · utility
62Cited by
20References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 1999 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | May 31, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of assembling a semiconductor device package includes first attaching a semiconductor device to a die-pad area of a leadframe. Electrical connections are then between electrical contact areas on the semiconductor device and electrical connection areas on the leadframe to form a device/leadframe assembly. An adhesion enhancing coating is then deposited on the exposed surface of the device frame/leadframe assembly before encapsulating the coated device leadframe assembly in an electrically insulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.