Method of forming a leadframe for a semiconductor package
US6852574B1 · kind B1 · utility
2Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2003 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Aug 11, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a leadframe (10) provides blocking fulcrums (21,23) adjacent to the leads (12,13,14, and 15). During the process of encapsulating the leadframe (10), the blocking fulcrums (21,23) restrict encapsulating material from exiting the mold cavity and from attaching to the leads (12,13,14, and 15).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.