Packaging microelectromechanical structures
US6852926B2 · kind B2 · utility
86Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2002 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Mar 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS device may be formed in a hermetic cavity by sealing a pair of semiconductor structures to one another, enclosing the MEMS device. The two structures may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components within the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.