Probe card assembly
US6853205B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 17, 2003 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Jul 17, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2889
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe card assembly is disclosed. The probe card assembly comprises a stiffener ring combining respectively with an upper printed circuit board and a lower printed circuit board. A plurality of coaxial transmitters are installed in the stiffener ring, and connect to the upper and lower printed circuit boards by cable connectors. The lower printed circuit board is assembled with a detachable probe head which comprises a silicon substrate with probing points and a probe head carrier. A downset is formed at the center of the probe head carrier. The standardized coaxial transmitters, printed circuit boards and probe heads are then assembled as a probe card assembly for testing all sorts of IC products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.