Anode impedance control through electrolyte flow control

US6855235B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Harald Herchen · Los Altos, US
• Craig Brodeur · Marlborough, US
• Quinwei Wu · Westford, US
• Peter Kimball · Mountain View, US
• Vincent E. Burkhart · Cupertino, US

Key dates

• Filing date: May 28, 2002
• Grant date: Feb 15, 2005
• Expiry date: May 25, 2023

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D17/12
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.