Methods and apparatus for testing and burn-in of semiconductor devices
US6856155B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2002 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Oct 7, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2863
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A testing scheme for ball-grid array devices of different sizes where the same ball-grid pattern may be tested using the same set of test adapters. A testing scheme includes providing a plurality of devices having a predetermined pattern of solder balls attached, providing a plurality of adapters secured to a test board, each of the adapters including a plurality of test contacts arranged in a pattern corresponding to the predetermined pattern of solder balls, removably attaching the plurality of devices to a device holding apparatus such that the predetermined pattern of solder balls on the devices corresponds to the predetermined pattern of test contacts on the plurality of adapters, then positioning the device holding apparatus to bring the plurality of solder balls in contact with the plurality of test contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.