Fast high-accuracy multi-dimensional pattern localization
US6856698B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2002 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Oct 18, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V10/752
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are provided for rapidly refining a given approximate location of a pattern to produce a more accurate location. The invention employs a multi-dimensional space that includes translation, orientation, and scale. The invention can serve as a replacement for the fine resolution phase of any coarse-fine system for pattern location. Patterns and images are represented by a feature-based description that can be translated, rotated, and scaled to arbitrary precision much faster than digital image re-sampling, and without pixel grid quantization errors. Thus, accuracy is not limited by the ability of a grid to represent small changes in position, orientation, or size (or other degrees of freedom). The invention determines an accurate object pose from an approximate starting pose in a small, fixed number of increments that is independent of the number of dimensions of the space, and independent of the distance between the starting and final poses, provided that the starting pose is within the “capture range” of the true pose. Thus, accuracy need not be sacrificed to keep execution time acceptable for practical applications. Specifying locations in four or more dimens…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.