Advanced chemical mechanical polishing system with smart endpoint detection
US6857947B2 · kind B2 · utility
22Cited by
33References
49Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2003 |
| Grant date | Feb 22, 2005 |
| Priority date | — |
| Expiry date | Jan 17, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.