Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
US6863797B2 · kind B2 · utility
18Cited by
140References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2002 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | Sep 10, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32134
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Electrolyte compositions and methods for planarizing a surface of a substrate using the electrolyte compositions are provided. In one aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, and one or more pH adjusting agents. In another aspect, an electrolyte composition includes one or more chelating agents, two or more corrosion inhibitors, and one or more pH adjusting agents. In another aspect, an electrolyte composition includes one or more chelating agents, one or more corrosion inhibitors, one or more pH adjusting agents, and one or more electrically resistive additives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.