Stan Tsai
81Patents
18h-index
75Co-inventors
87Inventor score
Filing activity: Nov 29, 1999 → Feb 3, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6379223B1 | Method and apparatus for electrochemical-mechanical planarization | Performing Operations; Transporting | 97 | Expired |
| US6299741A | Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus | Electricity | 72 | Expired |
| US6537144B1 | Method and apparatus for enhanced CMP using metals having reductive properties | Electricity | 64 | Expired |
| US6962524B2 | Conductive polishing article for electrochemical mechanical polishing | Electricity | 58 | Expired |
| US6309276A | Endpoint monitoring with polishing rate change | Performing Operations; Transporting | 51 | Expired |
| US7422516B2 | Conductive polishing article for electrochemical mechanical polishing | Electricity | 40 | Active |
| US6739951B2 | Method and apparatus for electrochemical-mechanical planarization | Performing Operations; Transporting | 36 | Expired |
| US7278911B2 | Conductive polishing article for electrochemical mechanical polishing | Electricity | 29 | Expired |
| US6524167B1 | Method and composition for the selective removal of residual materials and barrier materials during substrate planarization | Chemistry; Metallurgy | 29 | Expired |
| US6506097B1 | Optical monitoring in a two-step chemical mechanical polishing process | Electricity | 27 | Expired |
| US6561873B2 | Method and apparatus for enhanced CMP using metals having reductive properties | Electricity | 27 | Expired |
| US6991528B2 | Conductive polishing article for electrochemical mechanical polishing | Emerging Cross-Sectional Technologies | 25 | Expired |
| US6988942B2 | Conductive polishing article for electrochemical mechanical polishing | Emerging Cross-Sectional Technologies | 25 | Expired |
| US6638143B2 | Ion exchange materials for chemical mechanical polishing | Electricity | 23 | Expired |
| US9812365B1 | Methods of cutting gate structures on transistor devices | Electricity | 22 | Active |
| US6541384B1 | Method of initiating cooper CMP process | Chemistry; Metallurgy | 20 | Expired |
| US7066800B2 | Conductive polishing article for electrochemical mechanical polishing | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6669538B2 | Pad cleaning for a CMP system | Performing Operations; Transporting | 19 | Expired |
| US6863797B2 | Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP | Electricity | 18 | Expired |
| US6653242B1 | Solution to metal re-deposition during substrate planarization | Chemistry; Metallurgy | 18 | Expired |
| US6709316B1 | Method and apparatus for two-step barrier layer polishing | Electricity | 17 | Expired |
| US6613200B2 | Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform | Electricity | 15 | Expired |
| US7285036B2 | Pad assembly for electrochemical mechanical polishing | Electricity | 14 | Active |
| US9138860B2 | Closed-loop control for improved polishing pad profiles | Performing Operations; Transporting | 14 | Active |
| US7029365B2 | Pad assembly for electrochemical mechanical processing | Electricity | 14 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.