Via density rules
US6864171B1 · kind B1 · utility
3Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2003 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | Oct 9, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Thermo-mechanical stress on vias is reduced, thereby reducing related failures. This can be done by maintaining a via-to-metal area ratio at least as large as a predetermined value below which the additional stress on the vias does not significantly increase.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.