Semiconductor device testing apparatus and semiconductor device manufacturing method using it
US6864695B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2001 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | Oct 8, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07357
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Since each wiring line is formed on one surface of the associated beam at a prescribed width over the entire length of the beam, the beam has the same sectional shape taken in the width direction at any point along an arbitrary longitudinal direction of the beam. As a result, the second moment of area, which is determined by the shapes of the beam and the wiring line, is uniform. This prevents a problem of the curvature of a beam varying locally when the beam is bent by a prescribed amount due to contact of the probe with a pad of a subject body. This, in turn, prevents local concentration of stress in the beams and thereby prevents breakage of the beam. Therefore, the probe structure can be miniaturized while the strength of the beams is kept at a required level, whereby a semiconductor device testing apparatus capable of accommodating many probes can be realized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.