Method of backgrinding wafers while leaving backgrinding tape on a chuck
US6866564B2 · kind B2 · utility
5Cited by
11References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2002 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Jan 31, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, and then removed from the tape. A tool for applying tape to a chuck, as described herein, facilitates this method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.