Slurry recycling system and method for CMP apparatus
US6866784B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2001 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Jan 12, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A slurry recycling system for use in a chemical mechanical polishing (CMP) apparatus for polishing a workpiece by using a slurry containing an abrasive, a pH agent and a deionized water is provided. The slurry recycling system includes a slurry collection tank for storing the slurry used in the CMP apparatus as a recyclable slurry; an ultra filter for separating, from the recyclable slurry, a fluid ingredient containing the pH agent and the deionized water and the abrasive to allow the abrasive to be reintroduced into the slurry collection tank; and a reverse osmosis filter for separating, from the fluid ingredient, the pH agent and the deionized water to allow the pH agent to be reintroduced into the slurry collection tank and to allow the deionized water to be discharged out.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.