System and method for current-enhanced stress-migration testing of interconnect
US6867056B1 · kind B1 · utility
12Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2002 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Apr 3, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2858
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
For testing for stress-migration failure of interconnect, an interconnect test structure is formed with a first feeder line coupled to a test line by a first no-flux structure, and with a second feeder line coupled to the test line by a second no-flux structure. A respective width of ea ch of the first and second feeder lines is greater than a width of the test line. A resistance meter and a timer measure a stress-migration life-time of the interconnect test structure with a current being continuously conducted through the interconnect test structure that is continuously heated to a predetermined temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.