Method for rewiring pads in a wafer-level package
US6867479B2 · kind B2 · utility
5Cited by
2References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 19, 2002 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Mar 4, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for rewiring contact pads in the wafer-level package is inventively provided. In order to be able to make the terminals of the characterization pads available for testing in a wafer-level package without these terminals being available later to the end user, the invention provides that the rewiring line is led via the scribe line of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.