Modular memory device
US6867992B2 · kind B2 · utility
3Cited by
38References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2003 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Jan 13, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C5/063
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a modular memory device is presented comprising a substrate, a memory array fabricated above the substrate, and first and second circuitry fabricated on the substrate and under the memory array. The first and second circuitry allow the modular memory device to interface with first and second varieties of host devices, respectively. In another embodiment, a modular memory device is presented comprising a substrate, a memory array fabricated above the substrate, memory array support circuitry fabricated on the substrate, and logic circuitry fabricated on the substrate and under the memory array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.