Method and structure for interfacing electronic devices
US6870270B2 · kind B2 · utility
15Cited by
4References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2002 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | Dec 28, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method and structure for optimizing and controlling diffusional creep at metal contact interfaces are disclosed. Embodiments of the invention accommodate height variations in adjacent contacts, decrease planarization uniformity requirements, and facilitate contact bonding at lower temperatures and pressures by employing shapes and materials that respond predictably to compressive interfacing loads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.