Michael C. Harmes
5Patents
4h-index
9Co-inventors
46Inventor score
Filing activity: Dec 28, 2002 → May 14, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6870270B2 | Method and structure for interfacing electronic devices | Electricity | 15 | Expired |
| US8421225B2 | Three-dimensional stacked substrate arrangements | Electricity | 14 | Active |
| US7973407B2 | Three-dimensional stacked substrate arrangements | Electricity | 8 | Active |
| US8203208B2 | Three-dimensional stacked substrate arrangements | Electricity | 4 | Active |
| US7348217B2 | Method and structure for interfacing electronic devices | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.