Method of manufacturing a semiconductor device and a semiconductor device
US6872597B2 · kind B2 · utility
7Cited by
14References
15Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 24, 2004 |
| Grant date | Mar 29, 2005 |
| Priority date | — |
| Expiry date | Feb 24, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.