Fixed abrasive CMP pad with built-in additives
US6875097B2 · kind B2 · utility
50Cited by
13References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 3, 2003 |
| Grant date | Apr 5, 2005 |
| Priority date | — |
| Expiry date | Oct 3, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/346
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This invention discloses fixed abrasive chemical mechanical polishing pads, wherein the pad itself comprises at least one material selected from the group consisting of oxidants, wetting agents and other additives normally delivered via a polishing slurry, which assist in the polishing effectiveness of the pad. The improved polishing pad provides both the benefit of a fixed abrasive and the benefits of slurry based polishing systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.