Semiconductor device and method of manufacturing the same
US6875639B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 7, 2002 |
| Grant date | Apr 5, 2005 |
| Priority date | — |
| Expiry date | Nov 28, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip has a quadrangle main surface, a wiring substrate, and a resin seal member for sealing the semiconductor chip, in which the resin seal member has a quadrangle main surface which confronts the main surface of the semiconductor chip. A gate cut trace portion is formed on a side face extending along a first side of the main surface of the resin seal member. A sectional area of an area between the main surface of the wiring substrate and the main surface of the resin seal member at a position outside a side face of the semiconductor chip is smaller than a sectional area of an area between the main surface of the semiconductor chip and the main surface of the resin seal member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.