Capacitive interposer
US6875921B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 31, 2003 |
| Grant date | Apr 5, 2005 |
| Priority date | — |
| Expiry date | Oct 31, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass capacitor. In a through-hole caposer, micro-bumps on the die pass through through-holes in the caposer and contact corresponding landing pads on the package. As they pass through the caposer, power and ground micro-bumps make contact with the plates of the bypass capacitor. In a via caposer, power and ground micro-bumps on the die are coupled to power and ground landing pads on the package as well as to the plates of the bypass capacitor by power and ground vias that extend through the caposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.