Method to increase throughput in a dual substrate stage double exposure lithography system
US6876439B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2003 |
| Grant date | Apr 5, 2005 |
| Priority date | — |
| Expiry date | Aug 4, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7003
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A lithography system and method are used to increase throughput using multiple reticles to pattern multiple substrates that are positioned with respect to one another according to a predetermined sequence. For example, during a first exposure period a first reticle patterns a first set of substrates, during a second exposure period a second reticle patterns the first set of substrates and a second set of substrates, and during a third exposure period the first reticle patterns the second set of substrates, etc. This can continue with further pairs of substrates until all desired substrates are patterned. It is to be appreciated that after the first and second reticles are complete, third and fourth reticles can pattern the first and second, sets of substrates. As another example, other sequences can also be performed using four exposure periods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.