Combined eddy current sensing and optical monitoring for chemical mechanical polishing
US6878038B2 · kind B2 · utility
21Cited by
54References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2001 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Jul 6, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B7/105
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus has a polishing pad, a carrier to hold a substrate against a first side of the polishing surface, and a motor coupled to at least one of the polishing pad and carrier head for generating relative motion therebetween. An eddy current monitoring system is positioned to generate an alternating magnetic field in proximity to the substrate, an optical monitoring system generates a light beam and detects reflections of the light beam from the substrate, and a controller receives signals from the eddy current monitoring system and the optical monitoring system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.