Under bump metallurgy for Lead-Tin bump over copper pad
US6878465B2 · kind B2 · utility
10Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2003 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Jun 26, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention describes a method including providing a component, the component having a bond pad; forming a passivation layer over the component; forming a via in the passivation layer to uncover the bond pad; and forming an under bump metallurgy (UBM) over the passivation layer, in the via, and over the bond pad, in which the UBM includes an alloy of Aluminum and Magnesium.The present invention also describes an under bump metallurgy (UBM) that includes a lower layer, the lower layer including an alloy of Aluminum and Magnesium; and an upper layer located over the lower layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.