Injection molded image sensor and a method for manufacturing the same
US6878917B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2002 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Sep 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/011
Abstract
An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a -shaped structure. The molded structure encapsulates the metal sheets by way of injection molding and has a first molded body and a second molded body. The injection molded structure has a U-shaped structure and is formed with a cavity. The first boards are partially encapsulated by the first molded body. The second and third boards are exposed from bottom and side surfaces of the first molded body. The chip is mounted within the cavity. The pads are formed on the chip. The wires electrically connect the pads to input terminals of the first boards. The transparent layer covers over the first molded body to encapsulate the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.