Method for automatically determining the surface quality of a bonding interface between two wafers
US6881596B2 · kind B2 · utility
6Cited by
2References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2003 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Apr 30, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to a device and method for automatically determining the surface quality of a bonding interface between two wafers. The device includes a detector for automatically detecting a bonding wave at a predetermined measuring site to determine when bonding occurs at the measuring site, and a processing unit for automatically calculating the bonding speed based on a location of the measuring site and at least one other predetermined site.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.