Frederic Metral
8Patents
4h-index
14Co-inventors
46Inventor score
Filing activity: Apr 29, 2003 → Jun 23, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7022586B2 | Method for recycling a substrate | Electricity | 17 | Expired |
| US7601271B2 | Process and equipment for bonding by molecular adhesion | Emerging Cross-Sectional Technologies | 7 | Active |
| US6881596B2 | Method for automatically determining the surface quality of a bonding interface between two wafers | Electricity | 6 | Expired |
| US8158013B2 | Process for bonding by molecular adhesion | Emerging Cross-Sectional Technologies | 4 | Active |
| US6988936B2 | Surface preparation for receiving processing treatments | Electricity | 4 | Expired |
| US8091601B2 | Equipment for bonding by molecular adhesion | Emerging Cross-Sectional Technologies | 3 | Active |
| US7718534B2 | Planarization of a heteroepitaxial layer | Performing Operations; Transporting | 2 | Active |
| US7919391B2 | Methods for preparing a bonding surface of a semiconductor wafer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.