Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
US6881611B1 · kind B1 · utility
40Cited by
92References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2000 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Jul 2, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the bumps 12 so that a resin layer 13 sealing the bumps 12 is formed, a protruding electrode exposing step of exposing at least ends of the bumps 12 sealed by the resin layer 13 so that ends of the bumps 12 are exposed from the resin layer 13, and a separating step of cutting the substrate 16 together with the resin layer 13 so that the semiconductor elements 11 are separated from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.