Shigeyuki Maruyama
69Patents
17h-index
61Co-inventors
87Inventor score
Filing activity: Nov 19, 1984 → Feb 26, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6228684A | Wafer-level package, a method of manufacturing thereof and a method of manufacturing semiconductor devices from such a wafer-level package | Electricity | 75 | Expired |
| US6927343B2 | Contactor for testing miniaturized devices and components | Electricity | 54 | Expired |
| US6229320A | IC socket, a test method using the same and an IC socket mounting mechanism | Electricity | 47 | Expired |
| US5828224A | Test carrier for semiconductor integrated circuit and method of testing semiconductor integrated circuit | Physics | 46 | Expired |
| US6881611B1 | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device | Electricity | 40 | Expired |
| US4604572A | Device for testing semiconductor devices at a high temperature | Physics | 38 | Expired |
| US6466046B1 | Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactor | Physics | 37 | Expired |
| US5986459A | Semiconductor device testing carrier and method of fixing semiconductor device to testing carrier | Electricity | 36 | Expired |
| US6661247B2 | Semiconductor testing device | Electricity | 31 | Expired |
| US5757199A | Test carrier for semiconductor integrated circuit and method of testing semiconductor integrated circuit | Physics | 29 | Expired |
| US6433563B1 | Probe card with rigid base having apertures for testing semiconductor device, and semiconductor device test method using probe card | Physics | 26 | Expired |
| US7071487B2 | Wafer-level package having test terminal | Electricity | 25 | Expired |
| US5534785A | Integrated circuit bare chip carrier | Physics | 24 | Expired |
| US6563330B1 | Probe card and method of testing wafer having a plurality of semiconductor devices | Electricity | 22 | Expired |
| US6249135A | Method and apparatus for passive optical characterization of semiconductor substrates subjected to high energy (MEV) ion implantation using high-injection surface photovoltage | Electricity | 21 | Expired |
| US6472744B2 | Semiconductor module including a plurality of semiconductor devices detachably | Electricity | 21 | Expired |
| US6535002B2 | IC socket, a test method using the same and an IC socket mounting mechanism | Electricity | 17 | Expired |
| US6762431B2 | Wafer-level package with test terminals | Electricity | 17 | Expired |
| US6046598A | Test board and a test method using the same providing improved electrical connection | Physics | 17 | Expired |
| US6939142B2 | Semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact piece | Emerging Cross-Sectional Technologies | 16 | Expired |
| US7112889B1 | Semiconductor device having an alignment mark formed by the same material with a metal post | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6555764B1 | Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor | Emerging Cross-Sectional Technologies | 16 | Expired |
| US7471096B2 | Contactor for electronic parts and a contact method | Physics | 15 | Expired |
| US6767219B2 | Contactor, method for manufacturing such contactor, and testing method using such contactor | Physics | 14 | Expired |
| US6791345B2 | Contactor for testing semiconductor device and manufacturing method thereof | Physics | 13 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.