Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a lead
US6882021B2 · kind B2 · utility
80Cited by
44References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2003 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Aug 29, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Packaged microelectronic devices and methods of packaging microelectronic devices are disclosed herein. In one embodiment, the device includes an image sensor die having a first side with a bond-pad, an active area on the first side, and a second side opposite the first side. The device further includes a window at the first side of the image sensor die and a lead mounted to the second side of the image sensor die. The window is radiation transmissive and positioned over the active area of the image sensor die. The lead is electrically coupled to the bond-pad on the image sensor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.