Apparatuses for forming thin microelectronic dies
US6882036B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2004 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Apr 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatuses for forming thin microelectronic dies. A method in accordance with one embodiment of the invention includes releasably attaching a microelectronic substrate to a support member with an attachment device. The microelectronic substrate can have a first surface, a second surface facing opposite from the first surface, and a first thickness between the first and second surfaces. The attachment device can have a releasable bond with the microelectronic substrate, wherein the bond has a bond strength that is reduced upon exposure to at least one energy. The support member can be at least partially transmissive to the at least one energy. The method can further include reducing a thickness of the microelectronic substrate and directing a quantity of the at least one energy through the support member to the attachment device to reduce the strength of the bond between the attachment device and the microelectronic substrate. At least a portion of the microelectronic substrate can then be separated from the support member. The support member can accordingly provide releasable support to the microelectronic substrate while the thickness of the microelectronic substrate …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.