Michael Connell
23Patents
10h-index
13Co-inventors
72Inventor score
Filing activity: Jan 7, 1999 → May 21, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7001795B2 | Total internal reflection (TIR) CMOS imager | Electricity | 41 | Expired |
| US7115853B2 | Micro-lens configuration for small lens focusing in digital imaging devices | Performing Operations; Transporting | 37 | Expired |
| US6762074B1 | Method and apparatus for forming thin microelectronic dies | Electricity | 36 | Expired |
| US6896760B1 | Fabrication of stacked microelectronic devices | Emerging Cross-Sectional Technologies | 31 | Expired |
| US7169685B2 | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive | Electricity | 29 | Expired |
| US7037756B1 | Stacked microelectronic devices and methods of fabricating same | Electricity | 24 | Expired |
| US7022418B2 | Fabrication of stacked microelectronic devices | Emerging Cross-Sectional Technologies | 21 | Expired |
| US7037751B2 | Fabrication of stacked microelectronic devices | Emerging Cross-Sectional Technologies | 19 | Expired |
| US7557337B2 | Micro-lens configuration for small lens focusing in digital imaging devices | Performing Operations; Transporting | 12 | Expired |
| US6514795B1 | Packaged stacked semiconductor die and method of preparing same | Electricity | 11 | Expired |
| US7727785B2 | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive | Electricity | 10 | Active |
| US6894380B2 | Packaged stacked semiconductor die and method of preparing same | Electricity | 8 | Expired |
| US6198861A | Method of using thin-clad near infrared transparent optical glass fibers as evanescent wave sensors | Physics | 5 | Expired |
| US6882036B2 | Apparatuses for forming thin microelectronic dies | Electricity | 4 | Expired |
| USD922173S1 | Door handle | General | 4 | Active |
| US6995442B2 | Total internal reflection (TIR) CMOS imager | Electricity | 4 | Expired |
| US7405385B2 | Micro-lens configuration for small lens focusing in digital imaging devices | Performing Operations; Transporting | 4 | Active |
| US10704298B2 | Panic exit device and door handle | Fixed Constructions | 1 | Active |
| USD936446S1 | Exit device | General | 1 | Active |
| US11214996B2 | Retrofit latch adapter | Fixed Constructions | 1 | Active |
| US7297412B2 | Fabrication of stacked microelectronic devices | Emerging Cross-Sectional Technologies | 1 | Expired |
| US11905733B2 | Dampener for an exit device | Mechanical Engineering; Lighting; Heating | 0 | Active |
| USD906082S1 | Combined exit device and door | General | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.