Adhesion layer for a polymer memory device and method therefor

US6885021B2 · kind B2 · utility

Assignee

• Ovonyx Inc. · US

Inventors

• Mac D. Apodaca · San Jose, US
• Jon-won Lee · Sunnyvale, US
• Kuo-Wei Chang · Waltham, US

Key dates

• Filing date: Dec 31, 2001
• Grant date: Apr 26, 2005
• Expiry date: Jan 11, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N70/8828

Abstract

Briefly, in accordance with one embodiment of the invention, a device, such as a memory cell, includes a dielectric layer and a layer of phase-change material with an adhesion layer between the dielectric layer and the layer of phase-change material.