Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein
US6885108B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2003 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Mar 18, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10157
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming protective layers on a plurality of semiconductor device components carried by a fabrication substrate includes applying a layer of protective material to surfaces of the semiconductor device components. The layer of protective material is then severed and the fabrication substrate is at least partially severed. Cracks and delaminated regions that are formed during severing are then healed. The protective material may be applied as a preformed sheet or in a liquid form, then at least partially cured or hardened. If a curable polymer is employed as the protective material, it may be partially cured before severing is effected, then self-healed before being fully cured. Alternatively, a thermoplastic material may be used as the protective material, with healing being effected by heating at least regions of the thermoplastic material. Semiconductor device components, including chip-scale packages, which are formed by the method are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.