S. Hinkle
9Patents
5h-index
4Co-inventors
48Inventor score
Filing activity: Oct 25, 1996 → May 25, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6072228A | Multi-part lead frame with dissimilar materials and method of manufacturing | Electricity | 173 | Expired |
| US6140154A | Multi-part lead frame with dissimilar materials and method of manufacturing | Electricity | 140 | Expired |
| US6362022B1 | Multi-part lead frame with dissimilar materials and method of manufacturing | Electricity | 10 | Expired |
| US6885108B2 | Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein | Electricity | 7 | Expired |
| US6570244B1 | Multi-part lead frame with dissimilar materials | Electricity | 5 | Expired |
| US7321160B2 | Multi-part lead frame | Electricity | 3 | Expired |
| US6902952B2 | Multi-part lead frame with dissimilar materials and method of manufacturing | Electricity | 2 | Expired |
| US6946722B2 | Multi-part lead frame with dissimilar materials | Electricity | 2 | Expired |
| US7199464B2 | Semiconductor device structures including protective layers formed from healable materials | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.