Method and system for monitoring a process of material removal from the surface of a patterned structure
US6885446B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2002 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Oct 28, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/95607
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and system are presented for use in controlling a process of material removal from the surface of a patterned structure, by measuring at least one of residue, erosion, dishing and corrosion effects in the structure induced by this process. The structure is imaged utilizing phase modulation of light reflected from the structure, and a phase map of the structure is thereby obtained. This phase map is analyzed and data indicative of light reflective properties of layer stacks of the structure is utilized to determine a phase difference between light reflected from a selected measured site and at least one reference site spaced-apart from the selected site. The phase difference is thus indicative of the measured effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.