Slurry distributor for chemical mechanical polishing apparatus and method of using the same

US6887132B2 · kind B2 · utility

Assignee

• Multiplanar Technologies Incorporated · US

Inventors

• Jiro Kajiwara · Foster City, US
• Gerard Moloney · Milpitas, US
• Jun Liu · South San Francisco, US
• Junsheng Yang · Sunnyvale, US
• Ernesto Saldana · San Jose, US
• Cormac Walsh · Sunnyvale, US
• Alejandro Reyes · San Jose, US

Key dates

• Filing date: Sep 3, 2002
• Grant date: May 3, 2005
• Expiry date: Sep 3, 2022

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B57/02
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110); (ii) a head (116) adapted to hold the substrate (102) against the polishing surface; (iii) a mechanism to rotate the platen (106) during polishing; (iv) a dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) a distributor (125) between the nozzles (126, 128) and the head (116). In one embodiment, the apparatus (100) further includes a wiper (180) between the head (116) and the distributor (125) to remove used slurry and polishing byproducts from the surface (110), thereby reducing agglomerations or deposits that can damage the substrate (102) and improving yield. Optionally, the apparatus (100) further includes a dispenser (186) for dispensing a cleaning fluid before and/or after the wiper (180) to substantially eliminate buildup of deposits.