Microstructure devices, methods of forming a microstructure device and a method of forming a MEMS device
US6887732B2 · kind B2 · utility
12Cited by
20References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2001 |
| Grant date | May 3, 2005 |
| Priority date | — |
| Expiry date | May 7, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0118
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Microstructure devices, methods of forming a microstructure device and a method of forming a MEMS device are described. According to one aspect, a microstructure device includes: a semiconductive substrate; a monolithic microstructure device feature coupled with the semiconductive substrate, and wherein at least a portion of the microstructure device feature is configured to move relative to the semiconductive substrate; and a conductive structure provided directly upon the microstructure device feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.