Thermal processing system and thermal processing method
US6889004B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 17, 2001 |
| Grant date | May 3, 2005 |
| Priority date | — |
| Expiry date | Oct 31, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal processing system for heating a to-be-processed object while rotating the to-be-processed object by a placement part, and for performing thermal processing on the to-be-processed object by supplying a predetermined gas into a processing chamber. An outer ring part provided outside the processing chamber and an inner ring part provided inside the processing chamber have pluralities of circumferentially arranged magnetic poles. The magnetic poles apply magnetic forces between the outer ring part and inner ring part so that the inner ring part will follow the rotation of the outer ring part. The number of magnetic poles of the outer ring part and inner ring part are selected to achieve an allowable angular error when between the outer ring part and inner ring part during rotation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.