Copper electroplating method and apparatus
US6890416B1 · kind B1 · utility
67Cited by
53References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2002 |
| Grant date | May 10, 2005 |
| Priority date | — |
| Expiry date | Jul 29, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating apparatus prevents anode-mediated degradation of electrolyte additives by creating a mechanism for maintaining separate anolyte and catholyte and preventing mixing thereof within a plating chamber. The separation is accomplished by interposing a porous chemical transport barrier between the anode and cathode. The transport barrier limits the chemical transport (via diffusion and/or convection) of all species but allows migration of ionic species (and hence passage of current) during application of sufficiently large electric fields within electrolyte.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.