Method and apparatus for heating polishing pad
US6896586B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2002 |
| Grant date | May 24, 2005 |
| Priority date | — |
| Expiry date | Apr 6, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.