Abrasives for CMP applications
US6896710B2 · kind B2 · utility
4Cited by
11References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 3, 2003 |
| Grant date | May 24, 2005 |
| Priority date | — |
| Expiry date | Oct 3, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a novel, structurally improved, abrasive agent, with improved surface properties resulting, inter alia, in enhanced wettability, dispersability and bonding. More specifically, the present invention provides according to an aspect thereof, an abrasive agent comprising abrasive particles, said particles being in the form of a composite material comprising more than one metal oxide material. In another aspect, the present invention provides an abrasive agent comprising metal oxide abrasive particles, said particles being coated at least partially with an extraneous metal or metal bearing layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.