Front opening unified pod
US6899145B2 · kind B2 · utility
44Cited by
4References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 20, 2003 |
| Grant date | May 31, 2005 |
| Priority date | — |
| Expiry date | Mar 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67393
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A front opening unified pod (FOUP) used for temporarily and portably storing semiconductor wafers between processing steps includes a manifold for uniformly distributing a purge gas in the FOUP during a purging process between wafer processing steps. The manifold can be a variety of shapes, and can be located in a number of appropriate locations within the FOUP. The manifold generally extends the full height of the FOUP and includes a plurality of openings configured to direct a flow of purge gas above and below each wafer held by the FOUP.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.