Patent · US Expired

Mold assembly for a package stack via bottom-leaded plastic (blp) packaging

US6899534B2 · kind B2 · utility

7Cited by
37References
6Claims
0Family size

Assignee

Inventor

Key dates

Filing dateFeb 18, 2003
Grant dateMay 31, 2005
Priority date—
Expiry dateFeb 24, 2023

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K3/3426
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminated. Lead connections are on the bottom package surface, over the top package surface, and/or on the sides and ends of the package, enabling vertical stacking of the devices and simultaneous/alternative coplanar horizontal connections to other semiconductor devices, circuit boards, etc. A mold assembly with a castellated inner surface forms a package with alternating grooves and columns for holding side and end electrical connection surfaces.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.