Polishing apparatus
US6899603B2 · kind B2 · utility
24Cited by
27References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2004 |
| Grant date | May 31, 2005 |
| Priority date | — |
| Expiry date | Feb 2, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a polishing apparatus having a cover body with fluid pressing mechanism, during polishing, vibration and migration of sticking portion between a retainer and a membrane generated in downstream of rotation of a polishing platen is prevented by reducing sticking force between the retainer and the membrane to less than force needed to wafer polishing with rotation of the cover body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.